Yxlon-Feinfocus

YXLON International GmbH, the leading supplier of industrial X-ray inspection systems and computed tomography solutions for the non-destructive testing of materials (NDT), is an innovative high-tech company with a long tradition. YXLON has belonged to the COMET Holding AG (Switzerland) corporate group since June 2007. The COMET FeinFocus division was integrated into the corporate structure at YXLON as a product line in the course of this transition. As a result, YXLON is now able to cover the strong demand for X-ray and CT systems in the microfocus sector as well, for instance, the way they are used in the electronics industry. YXLON offers a wide range of X-ray techniques at our application centers. We design solutions that replace X-ray films, provide radioscopy and fully automatic defect recognition in X-ray images, as well as computed tomography services for scanning inspection items ranging from micro-CT to CT using a linear accelerator.

The selection offered by YXLON encompasses both microfocus and conventional X-ray and CT technologies. The portfolio ranges from portable systems designed for application in the field to standardized modular solutions, complex, fully automatic systems and systems specific to the customer, all the way to FeinFocus microfocus X-ray and µCT systems.

Microfocus X-ray tubes for very large geometric magnifications
X-ray radiation is caused by fast-moving electrons that collide with a solid body. The electrons are generated in a vacuum by a glowing filament (cathode). In the case of open microfocus tubes, this filament can be replaced. As a result, the lifespan for this type of tube is unlimited. The freely moving electrons are accelerated within the vacuum by an electrical field. This field lies between the filament and the centering coils (alignment unit).

The special features of microfocus X-ray tubes in comparison to conventional X-ray tubes are the centering coils and the focusing coils (objective lens). The centering coils center the beam of electrons so that it hits the target in the center. The focusing coils focus the electrons on the target. As a result, the beam source measures only a few micrometers. The fact that this beam source is so extremely small means that a several thousandfold geometric magnification can be achieved.

This technology is used in the YXLON FeinFocus X-ray systems Y.Cheetah and Y.Cougar.

Y.Cougar

y.cougar

Y.Cheetah

ycheetah

 

Application in SMT manufacturing
2D microfocus X-ray technology from YXLON enables the rapid and detailed evaluation of BGAs, from research & development all the way to series inspection during production. It reveals typical defects such as blowholes, short-circuits, solder ball lift, microcracks or deformed solder balls. Any of these can lead to electronic system failure or declining reliability.

Microfocus computed tomography (μCT) enables a deeper view into the three-dimensional structure, even in the tiniest components and assemblies, and supplies additional information about the defects, for instance the volume size of blowholes, ball shear size when a solder ball has lifted, or the pad surface structure in the case of an unsoldered solder ball. This supplementary information simplifies the analysis of the causes of defects.

The X-ray systems Y.Cheetah and Y.Cougar have both technologies.
We offer you a wide range of X-ray techniques at our application centers. We design solutions that replace X-ray films, provide radioscopy and fully automatic defect recognition in X-ray images, as well as computed tomography services for scanning inspection items ranging from micro-CT to CT using a linear accelerator.

Application in backend micro-electronics packaging
At first the individual dies are glued onto a housing. The first source of defects are incomplete gluing surfaces or a tilting of the die. What can occur then is that dissipated heat is not diverted from the die and the component is destroyed due to internal overheating. The quality of the gluing surface can be tested using void calculation. The glued-on die is subsequently electrically bound to the housing using wire bonding. 

Typical defects during bonding are broken or chipped wires, excess wires, missing wires and ball bonds that have lifted. It can also happen that bonding wires unintentionally touch each other. Most of the time no difference can be made between these defects in a function test. Using the YXLON technology in the X-ray systems Y.Cheetah and Y.Cougar, these defects can be detected, allowing measures for improvement to be integrated into the production process. 

Example images:

µCT image

 ct 

Wire Bond Inspection

bonding

 

Specifications

Y.Cougar

  • Easy to use Microfocus X-ray system for non-destructive testing featuring highest resoltion and magnification
  • 1-click solutions for rapid inspection e.g. Click & Centre, Frame & Zoom
  • CNC-controlled collision-free sample manipulation
  • +/- 70° oblique viewing with highest magnification
  • Automatic tracing of the sample (AIM-technology) when pivoting the detector or rotating the sample, details under inspection remain in the middle of the image
  • High-speed digital detector for superior detail detectability already available in the basis system
  • Generation of automatic X-ray inspection procedures by intuitive teach-in concept
  • Best resolution at high target power (up to 15 W) through unique High-Power Target (optional)
  • Windows 7 (64bit) operating system
  • μCT-upgradable on customer
  • Small and compact, service-friendly and modular design
  • Inspection area (max.) 310 mm x 310 mm (12" x 12")
  • Sample size (max.) 440 mm x 550 mm (17" x 21")

Y.Cheetah

  • Easy to use Microfocus X-ray system for non-destructive testing featuring highest resoltion and magnification
  • 1-click solutions for rapid inspection e.g. Click & Centre, Frame & Zoom
  • Zoom+ for brilliant images and faster inspection without tube adjustments or software interpolation
  • +/- 70° oblique viewing with highest magnification
  • Automatic tracing of the sample (AIM-technology) when pivoting the detector or rotating the sample, details under inspection remain in the middle of the image
  • High-resolution digital detector for superior detail detectability < 0.5 microns
  • Generation of automatic X-ray inspection procedures by intuitive teach-in concept
  • Best resolution at high target power (up to 15 W) through unique High-Power Target (optional)
  • Windows 7 (64bit) operating system
  • μCT-upgradable on customer
  • Air suspensioned manipulation unit
  • Service-friendly design
  • Inspection area (max.) 460 mm x 410 mm (18" x 16")
  • Sample size (max.) 800 mm x 500 mm (31" x 19")

 

 

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