X-Ray Inspection

X-Ray inspection has become an integral part of test and inspection in electronics production. This non-evasive technology helps to analyse soldering results on high density double-sided boards, even equipped with ball grid array's. Solutions are available for off-line analysis as well as for in-line 100% 3D inspection.
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prana Goepel electronic provides 3D in-line X-ray inspection system for maximum fault coverage using digital tomosynthesis with outstanding inspection speed
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sec logo SEC manual and semi-automatic X-ray analysis equipment. Provides off-line, easy to-use but powerful analysis for PCBA's and other materials
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Latest News

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16-may-2012
Royce
New 600 Series Bond Test Instruments
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8-may-2012
Goepel
introduces a new generation of
Inline Onboard Programmer
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27-apr-2012
Teseq
introduces a 3-Phase 200A Burst Coupling network
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21-apr-2012
Milmega Ltd
wins Queen’s Award
for Innovation 2012
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2-febr-2012
Teseq
acquires Milmega to expand RF Amplifier capabilities
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25-jan-2012
Accelonix
Inspection Xpress: Software Assistance for faster and better Visual Inspection
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2-dec-2011
ADT
More than Dicing!
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