Wire Bonding

The requirements for a good wire bonder depend on the application you have got. Some products require ball bonding, where other are better of with wedge bonding. Of course the production volume can also vary significantly. A university will have other requirements as an OEM company. Accelonix has created a Wire Bonder range that covers all applications.

By clicking on the logo or name of your choice, you will be linked to the page with more information

hesse_knips_logo Hesse & Knipps is the specialist when it comes to high quality wire bonding for production volumes. The range of equipment can handle thin wire, thick wire and ribbon. Of course we can also design custom toolings for your application.

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logo2 TPT is manufacturer of manual and semi automatic wire bonders. Specific strong points are:
- Ball- & Wedgebonding in 1 system
- True linear Z-motion
- Innovative manufacturer, with German quality

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Latest News

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16-may-2012
Royce
New 600 Series Bond Test Instruments
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8-may-2012
Goepel
introduces a new generation of
Inline Onboard Programmer
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27-apr-2012
Teseq
introduces a 3-Phase 200A Burst Coupling network
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21-apr-2012
Milmega Ltd
wins Queen’s Award
for Innovation 2012
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2-febr-2012
Teseq
acquires Milmega to expand RF Amplifier capabilities
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25-jan-2012
Accelonix
Inspection Xpress: Software Assistance for faster and better Visual Inspection
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2-dec-2011
ADT
More than Dicing!
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Accelonix News Archive