Rehm Condensation Soldering

Rehm Thermal Systems

Condenso - Condensation soldering with a difference...

In fact, Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free and reliably for maximum return on investment.

Top quality soldering results without compromise

Condenso brings major design advantages over traditional vapor phase soldering systems, making it the first choice for top quality soldering results.

Performance: Vapor in condensation soldering provides extremely effective heat transfer, while also keeping the temperature of the medium constant. The specific boiling point limits the system’s maximum soldering temperature, preventing overheating and guaranteeing a repeatable performance you can trust The addition of Vacuum will secure a void free soldering connection

Reliability: Vaporizing a defined quantity of inert gas during reflow, the system ensures precision temperature profiling to eliminate the potential for component damage. Maximum profile flexibility can be achieved utilizing Condenso’s precision medium injection timing and quantity control, and even its exhaust. Your profiling possibilities are almost limitless.

Value: Horizontal PCB transportation ensures that components cannot be shifted out of place during soldering, reducing scrap rates and enhancing long-term cost-of-ownership. “On-demand” operation enables the system to idle when not in use, and requires just a momentary warm-up cycle before production resumes. This results in lower power and fluid consumption than that of systems which run continuously throughout production shifts.

top quality soldering results
pinpoint temperature accuracy
improved thermal transfer
no overheating components
void-free vacuum soldering
no component movement
no residues
no pre-heat necessary
maximum profile flexibility
faster cleaning

Accurate soldering process and pinpoint profiling

A defined quantity of an inert fluid (usually perfluorpolyether) is vaporized during reflow soldering in the process chamber, which is hermetically sealed by means of a bulkhead. The vapor allows for extremely effective heat transfer to the PCBs due to the release of heat during condensation, and the temperature of the medium remains constant.	In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot be damaged due to overheating. This, as well as the ability to control the volume of injected liquid and intermediate exhaust of the vapor, also makes it possible to precisely adjust the temperature/ reflow profile of the PCB. Flawlessly reproducible soldering results are thus guaranteed, which minimizes scrap rates.	Smallest ΔT Extremely efficient and uniform heat transfer over the complete assembly Maximal soldering temperature limited from the boiling temperature of the Galden Patented injection principle warrants repeatable solder results and allows optimal profiling control of gradients Time efficient profiling

Condenso features

Medium recycling

A partial vacuum is generated when the vapour is drawn off, assuring quick drying of the PCBs. The vapour is cooled down after it has been drawn off. After it has condensed, it is filtered and impurities are removed. The fluid is then returned to the soldering process. Due to the fact that the process chamber is hermetically sealed, only minimal loss results from vaporization during the soldering process. Medium consumption, as well as costs, are thus significantly reduced.

Hermitically sealed process chamber
Fluid filtering and recycling
Drastic reduction of fluid consumption
Environmental friendly

Cooling

After the soldering process, the PCB can then be advanced out of the process chamber for cooling. Here you’re provided with the option of reducing the standard air cooling temperature to a constant low level with the help of water. This makes it possible to cool the PCB absolutely uniformly, and above all more quickly. Furthermore, the machine’s ambient temperature is not significantly increased.

Standard: Air cooling
Option: water cooling for faster and uniform cooling down

Transport

The assemblies are transported strictly horizontally through the soldering system. Furthermore, the PCB is stationary during the soldering process. In this way, components cannot be shifted out of place while the solder is molten. It has thus been possible to eliminate a considerable disadvantage associated with conventional vapour phase soldering systems within which continuous vertical motion of the PCBs is required during soldering. Scrap rates are reduced as a result, as well as costs.

Horizontal conveyor
PCB's don't move during the process
Optional, high speed handling systems available

Vacuum - up to 2 mBar

Void-free soldering with lead-free solders is an important prerequisite for the production of power electronics. However, minimal void rates are only possible with soldering processes which subject the molten solder to a vacuum, making it easier for any remaining residues to escape from the solder joints. For this reason, the Condenso can be equipped with a vacuum pump upon request. This results in solder joints with surface contact ratios of greater than 99% in many cases. In addition to the vacuum process during the melting phase, vacuum can also be applied before starting with the soldering process itself. This allows not only an uniformly injection of the Galden but the evaporation of the solvents of the paste. Furthermore, through the pre-vacuum, the oxygen of the chamber is replaced with nitrogen, eliminating oxidation.	Without vacuum	Surface contacts up to 99%	With vacuum
		Improved filling of micro vias and THD-solder joints
		Minimum of voids (particularly important on power semiconductor assemblies)
		Improved wetting