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ST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.
Turnkey solutions for:
• Eutectic Die Bonding
• Flux-Less Solder Reflow
• MEMS Package Sealing
• Component Assembly
• Hermetic Package Sealing
• Getter Activation
• Glass Sealing
• Wafer Bonding
• Solder Ball Bumping
• Precision Thermal Profiling
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Model 1200 Table Top Solder Reflow Station
Ideal for low volume, high reliability hermetic package
sealing, eutectic die attach, process development and
university research.
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Model 3130 Vacuum/Pressure Furnace
The industry standard for flux-free, void-free solder
assembly of hybrids, fiber optic packages, power devices,
BGA devices, plus high temperature glass sealing and
brazing processes.
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Model 3140 and 3150 High Vacuum Furnaces
High vacuum thermal processing furnaces used for
MEMS package sealing, getter activation and very high
reliability, low moisture hermetic package sealing. |
Model 5100 Vacuum/Pressure Soldering Furnace
Large format programmable vacuum/pressure soldering
furnace ideally suited for producing high volume
microelectronic components and packages
process.
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Request documentation
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Microelectronics 
