SST International

ST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.

Turnkey solutions for:
• Eutectic Die Bonding
• Flux-Less Solder Reflow
• MEMS Package Sealing
• Component Assembly
• Hermetic Package Sealing
• Getter Activation
• Glass Sealing
• Wafer Bonding
• Solder Ball Bumping
• Precision Thermal Profiling

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Model 1200 Table Top Solder Reflow Station
Ideal for low volume, high reliability hermetic package
sealing, eutectic die attach, process development and
university research.

Model 3130 Vacuum/Pressure Furnace
The industry standard for flux-free, void-free solder
assembly of hybrids, fiber optic packages, power devices,
BGA devices, plus high temperature glass sealing and
brazing processes.

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Model 3140 and 3150 High Vacuum Furnaces
High vacuum thermal processing furnaces used for
MEMS package sealing, getter activation and very high
reliability, low moisture hermetic package sealing.

Model 5100 Vacuum/Pressure Soldering Furnace
Large format programmable vacuum/pressure soldering
furnace ideally suited for producing high volume
microelectronic components and packages
process.

Request documentation

 

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