The HB16 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge, for Wedge/Wedge and for die bonding mode. The bonder has an in-built touch-down sensor, which means that stage adjustments for different bond heights is not necessary. Also loop shapes are fully programmable. Easy operation with TFT touch Panel Operator system. Direct and simple access to all bond parameters and programs.
The HB16 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge, for Wedge/Wedge and for die bonding mode. The bonder has an in-built touch-down sensor, which means that stage adjustments for different bond heights is not necessary. Also loop shapes are fully programmable. Easy operation with TFT touch Panel Operator system. Direct and simple access to all bond parameters and programs.
