ADT is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation. ADT offers dicing equipment with a variety of capabilities and levels of automation to suit an ever-growing range of customer requirements. Combining our dicing equipment and annular dicing blades, we bring our customers a complete range of dicing solutions.
ADT7100 Dicing Saw With four different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the full spectrum of dicing materials from IC wafers to package singulation and hard material application
ADT7200Automatic Dicing Saw Offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications.
ADT7900 Dual Spindle (NEW) The ultimate dicing system for LED & Discrete devices. With lower Cost of Ownership and ability to double you dicing floor productivity.
ADT8000 NextStepLaser Scribing Removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then diced using a standard mechanical dicing process.
Peripheral Equipment We offer a broad range of peripheral equipment to complement our Dicing Saws, such as wafermounters, tape curing systems, filtration systems, and many more....
Dicing Tools A wide selection of dicing tools to support your process requirements: Annular Dicing Blades (Resin-bond, Metal-Sintered and Nickel-bond Blades), Dicing Flanges and Dicing Accessoiries.
Microelectronics 
