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Royce Instruments - Bond Testing and Die Handling Equipment
For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment.
Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak™
Bond Testing Equipment
Royce System 650
 Universal Bond Tester
The Royce 650 bond tester is the latest bond tester by Royce, which can be used to pull test, bond shear and die shear. It has a very user friendly S/W, which can be readily networked and the system has industry leading accuracy. The 650 system also automatically can collate and export a wide variety of SPC data, to ensure that quality of production can be easily tracked.
Royce System 226
 Dedicated Wire Pull Tester
The 226 Royce Pull Tester is a dedicated wire-pull system. It has a very small footprint, while still maintaining high-end accuracy and repeatabilty.
Die Handling Equipment
Royce Autoplacer MP300
 Automatic Die Handling & Sorting System
The MP300 Autoplacer is a fully automatic pick and place system at entry level price. It is ideal for a high mix, medium volume environment. The MP300 has a flexible and user friendly die sorting S/W, which can easily cope with variable die sizes on multi project wafers. The die can be sorted in up to 256 different bin codes.
Royce System DE35-ST
 Semi-Automatic Die Handling System
The DE35-ST is a simple low-cost semi-automatic die handler. The system can handle a very wide range of die size and also has a Non-Surface-Contact option for very fragile or thin die. It has many inspection options to ensure that only good quality die are selected.
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Microelectronics 
