Micro Electronics

In the Microelectronics business, speed and accuracy are key - but we understand that keeping up with your customers as well as with the speed of change can be a real challenge.
So we do all we can to help you stay ahead.

We introduce innovative technologies and products to the electronics industry. We don't simply help you to find a better way of doing things, we help you to keep pace with technology as it evolves, pre-empting problems in good time and recommending solutions that exactly match your needs. Owning the issues with you - help you break through barriers.

In a fast moving sector, we take time to understand your particular outlook, aims and challenges, so we can help you find that exclusive solution - a better way. Then we move with you offering innovative products, thorough technical support and simple informed advice.

By clicking on the logo or name of your choice, you are linked to the page with more information.

 

Bond Testing
ribbon_pull_main Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities. royce_logo

 

 

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Dicing
dicing Manual, Full-Automatic & Dual Spindle Dicing Systems, Laser Scribing Systems, Peripheral equipment, Blades & Proces Development. adt

 

 

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Die Bonding
diebonding Tabletop Die Bond systems for development purposes. Full & Semi- Automatic, high accuracy Die Bond System for medium and high volume production. As wel as standard and customized tooling. mat_onlylogo
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Die Sorting
die handling A range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

Wafer map capabilities include multi-project wafers and industry standard wafer formats.

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Plasma Cleaning
plasma_cleaning From Tabletop systems to high volume in-line plasma threatment systems for advanced semiconductor packaging and assembly processes. web_logo_sm

 

 

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Soldering & Sealing
safety_test Vacuum furnaces for flux-free and void-free soldering, brazing and glass sealing solutions. Production of high precision graphite tooling and fixturing. logo

 

 

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Wire Bonding
wire_bonding Manual, Semi-Automatic and Full Automatic Wire Bond System for Wedge, Ball, Bump and Ribbon Bonding. High quality Capilary's, Wedges and Bonding Wires. hesse logo
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X-Ray Inspection
x-ray X-Ray inspection has become an integral part of test and inspection in micro electronics production. This non-evasive technology helps to analyse the quality of your packaging process. Solutions are available for off-line analysis as well as for in-line, 100% 3D inspection. yxlon

 

 

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Non-Contact 2D & 3D Surface Metrology
Surface metrology

High‑resolution, non‑contact optical 2D / 3D measurement systems for industrial and scientific applications. With a range of high resolution optical sensors; confocal white light or laser‑based in point, line or microscope format.

Cybertechnologies

 

 

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Thermal Warpage & Strain Metrology
Thermal Warpage & Strain Metrology

The Akrometrix systems will provide warpage metrology over a temperature profile. The users will be able to measure substrate warpage, understand the mating interface between two substrates and how temperature affect strain on materials.

Akrometrix

 

 

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Consumables
sinewave A full range of consumbles to for your Dicing, Die Bond, Wire Bond and Test processes. adt
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Latest News

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jun-2017
EM Test New ESD Simulator

NX 30 - New 30kV ESD Simulator with Bleed-off function.
more...


EM Test Surge Generator for Solar Panel testing
New vSurge NX 20
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3-phase Power Sources from EM Test
Netwave Series
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MPE - World First Gb Ethernet Filter
Low-Pass EMI Filter
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Rental solutions for EMC instrumentation
Accelonix Rental Service
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05-may-2017
Accelonix at E&A 2017
Accelonix exhibiting at Electronics & Applications 2017.
May 30 May to June 1th, Jaarbeurs Utrecht.


22-feb-2017
TestWay Seminar

DFx Software Tools to Optimize PCBA Manufacturing & Test Strategy.
April 4, Eindhoven


08-feb-2017
Yxlon FeinFocus

Non-Destructive X-ray Inspection Technology for Electronics.
more...


01-feb-2017
Aster twSystem

New system level PCB viewer.
more...


26-jan-2017
Hesse New BJ 955/959

New Bonder platform for Manual and Automated Heavy Wire Bonding.
more...


18-jan-2017
Akrometrix

Thermal Warpage & Strain Metrology Measurement Systems.
more...


27-nov-2016
CyberTECHNOLOGIES
Non-Contact 3D Surface Metrology Measurement Systems.
more...


15-nov-2016
TPT Wire Bonding Workshop
Learn about Wire Bonding and discover the TPT Solutions during this Free Workshop!

 


sep-2016
XRH Count
Revolution in automatic, contactless SMT component counting!
more...


june-2016
FEE EMC Seminar
Thank you for visiting us in St-Katelijne-Waver


may-2016
Teseq ITS 6006B
Radiated immunity test system up to 6GHz, Second Generation released
more...



Teseq NSG 4070B
RF immunity test system up to 1GHz. Now also supports draft version (2015) of ISO 7637-4
more...



Teseq NSG 4060
Meets new immunity testing requirements range 15kHz-150kHz
more...



MPE Plug-in Tempest Filters
Protect your IT systems with this range of convenient, plug-in TEMPEST filters
more...


mar-2016
Accelonix BV has moved!
Accelonix has moved to a new office space since March 12th 2016
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jan-2016
Data I/O LumenX
Data I/O Ultra-Fast eMMC Programming!
more...


Accelonix News Archive