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Goepel
GOEPEL electronic has been one of the pioneers of the most innovative electrical test technology for electronic components and PCBs, JTAG/Boundary Scan. All engineering tasks required to introduce the Boundary Scan technology up to the generation of product-specific test programs as well as training seminars are part of the overall customer support by GOEPEL electronic.
In the meantime, Automated Optical Inspection and Automated X-Ray Inspection has developed to one of the most commanding test technologies in electronic production. In the first year just a few systems were manufactured, but relatively quickly a product range emerged that found an appropriate infrastructure in the new company building, which was opened in 2003.
Additionally, the functional test of electronic assemblies and devices, in particular for Automotive Testing, has been one of the supporting pillars in the Company’s business activities. They are mainly focussed on the requirements of the automotive industry.
Furthermore the customized Functional Test Systems optimally suit for the automation of test runs. Integrated in a production line, as test system for final products or as repair station, versatile requirements can be realised with these systems.
Automated X-Ray Inspection - AXI
OptiCon XLine 3D
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3D in-line X-ray inspection system for maximum fault coverage using digital tomosynthesis with outstanding inspection speed. Real-time 3D detector concept with maintenance-free micro focus X-ray tube that allows simultaneous image capturing from different angles.
Main Features:
- Revolutionary GigaPixel technology.
- Real-time multi angle image recording is the basis that enables a test speed of 40cm²/s at full 3D PCB capturing.
- Analyse solder joints on various levels and to determine the wetting state
- Reconstruction processes possible due to tomosynthesis
- Simultaneous inspection of top and bottom side of a double sided PCB
- Parallelization of PCB loading, unloading and test all simultaneously - reduction of the PCB handling time to 5 s
- Optimal adaptation to future components and manufacturing requirements via Software XI-PILOT
- Algorithm library suitable for all common components
- Modular concept - configuration options for 2D and 3D systems as well as different levels of inspection speed
Unique option to integrate double-sided Automated Optical Inspection into its AXI system OptiCon X-Line 3D.
The AOI module integration into OptiCon X-Line 3D enables a non-stop image capturing of the board top and bottom side parallel to the X-ray inspection without test speed limitations. The AOI option allows a colour image capturing at a resolution of 20µm. The module can be integrated optionally for testing either top or bottom side, or the double-sided inspection of the PCB.
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