X-Ray Inspection

X-Ray inspection has become an integral part of test and inspection in electronics production. This non-evasive technology helps to analyse soldering results on high density double-sided boards, even equipped with ball grid array's. Solutions are available for off-line analysis as well as for in-line 100% 3D inspection.
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	Goepel electronic provides 3D in-line X-ray inspection system for maximum fault coverage using digital tomosynthesis with outstanding inspection speed more...
	SEC manual and semi-automatic X-ray analysis equipment. Provides off-line, easy to-use but powerful analysis for PCBA's and other materials more...

^10-jun-2010
Finero
Launches their new QUANTI series^®
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^06-apr-2010
Goepel electronic
In-System Emulation technology VarioTAP^® expands to support Xilinx^® FPGA
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^{01-March-2010}
New Accelonix website online

^16-dec-2009
Goepel electronic
SCANFLEX JTAG/Boundary Scan extended test coverage for RS422/RS485-Interfaces
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^20-nov-2009
Data I/O
FlashCORE III Wins a 2009 Global Technology Award
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^13-nov-2009
Teseq
Introduces new & improved automotive emissions system
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^10-nov-2009
Goepel electronic
AXI System OptiCon X-Line 3D upgraded by double-sided AOI Inspection
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^12-okt-2009
Laplace Instruments ltd
Introduces new 61000-4-6 Conducted Immunity testsystem
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^1-okt-2009
Data I/O
Introduces Flashcore III technology
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^30-sept-2009
Accelonix
10th edition Boundary Scan Day
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