Since 1996, TPT has designed and manufactured a range of manual and semi-automatic wire bonding machines, suitable for 17µ to 75µ Gold- and Aluminium- wire and 25µ x 200µ ribbon:

Innovation and quality are the two main TPT values. Innovation - TPT introduced the worlds first wire bonder capable of either Wedge or Ball bonding, simply by the change of its bond tool. Quality - TPT is a privately owned company, with the goal of providing the highest quality wire bonding equipment for the semiconductor and microelectronic industries. TPT Bonders are in use all over the world in Universities, Colleges, Institutes and in leading Semiconductor, Aerospace and Medical Device manufactures, to name a few.

HB03 HB04 HB05 (NEW) Fullly manual Wire Bonder, without motorized axis. Easy operation.	HB06 HB08 HB10 Semiautomatic Wire Bonder with motorized Z- axis. Upgradable to HB16!

HB12 HB14 HB16 Semiautomatic Wire Bonder, with motorized Z & Y axis, touchscreen control.	HB16D Wire and Die Bonder Pick and place option for HB16

Wire Bond Consumables Au & Al bondingwires & ribbons. Wedge & capillary bonding tools, unplugging probes.

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