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Since 1986 this company was mainly working in the field of industrial automation. In 1995 Hesse & Knipps started to build and sell high tech equipment for semiconductor industry. The headquarters are located in Paderborn, Germany.
Hesse & Knipps GmbH develops and delivers customer specific equipment for the back-end semi conductor industry: bonders, ultrasonic flip-chip systems and special systems right up to complete production lines
Below you will find an overview of all Wirebonding related equipment from Hesse-Knipps. From Fine Wire Wedge Bonders to Heavy Wire Wedge Bonders: |
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BJ 715/815
Thin Wire Wedge bonder with large, easy
access working area and fast bondspeed.
User friendly software and effective proces
control. High quality & wear free bondhead
for the high bond speed and better bond
quality.
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BJ 820
Thin Wire Wedge Bonder for all wirebonding
challenges on a single platform for a
large variety of applications. The BJ820 defines
benchmark in the industry for example by offering:
Fastest wiring speed of a wedge bonder, largest
work area, highest axis accuracy.
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BJ 915 L
Leadframe Bonder with integrated pull test.
The adjustment guidance by inspection camera
and the compatibility to the advanced quality
control system PiQC further position the
BJ915L in the market as the Leadframe bonder
for highest quality requirements
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BJ 920
Fully Automatic Heavy Wire Bonder with
integrated pull test. The adjustment guidance
by inspection camera and the compatibility
to the advanced quality control system further
position the BJ920 in the market as the heavy
wire bonder for highest quality requirements
process.
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BJ 935/939 (NEW)
Heavy wire bondhead with non destructive
pull test and a unique transducer integrated
sensor for 100% quality monitoring in real-
time. Further outstanding features are high
speed and the largest bonding area.
Advanced features available on BONDJET
BJ935 and BJ939 are designed to meet
your present and future requirements and
greatly enhance productivity.re....
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Options
A wide selection options to support
your process, like Process integrated
Quality control (PiQC) or the adjust-
ment tool for wirebonders (E-Box).
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Request documentation
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Microelectronics