TPT's Wire and Die Bonder - HB16D

The HB16 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge, for Wedge/Wedge and for die bonding mode. The bonder has an in-built touch-down sensor, which means that stage adjustments for different bond heights is not necessary. Also loop shapes are fully programmable. Easy operation with TFT touch Panel Operator system. Direct and simple access to all bond parameters and programs.

Wire Bonding
• Wedge and Ball Bonding
• 17µ to 50µ Wire and 25µ x 200µ Ribbon
• Loop Profile Programmable
• Stich Bonding and Bump Bonding
• Electronic Ball Size Control
• Motorised Wire Clamp
• Motorized 2" Wire Spool Holder

Die Bonding
• Placement Accuracy ± 25µ
• Substrat Size Max. 100 x 100 mm
• Die Size Max. 10 x 10 mm
• Die Size Min. 0.3 x 0.3 mm