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Die Bonding
After dicing your wafer, picking, placing and attachment of the Die would be the next process step. Being a turn key solutions provider Accelonix can of course also help you with this part of your packaging process.
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MAT is real specialist when it comes to Die attachment. No matter if you use eutectic bonding or adhesive or if you use an MCM or flip chip process, MAT has the right solution.
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TPT has been a high quality manufacturer of manual and semi automatic wire bonders. With their HB16D die bonder TPT now also offers a manual Die bonder suitable for R&D purposes and low volume production.
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Microelectronics