Micro Electronics

In the Microelectronics business, speed and accuracy are key - but we understand that keeping up with your customers as well as with the speed of change can be a real challenge.
So we do all we can to help you stay ahead.

We introduce innovative technologies and products to the electronics industry. We don't simply help you to find a better way of doing things, we help you to keep pace with technology as it evolves, pre-empting problems in good time and recommending solutions that exactly match your needs. Owning the issues with you - help you break through barriers.

In a fast moving sector, we take time to understaand your particular outlook, aims and challenges, so we can help you find that exclusive solution - a better way. Then we move with you offering innovative products, thorough technical support and simple informed advice.

By clicking on the logo or name of your choice, you are linked to the page with more information.


Bond Testing
bond_testing The Dage 4000 can be configured as a simple pulltester, and upgraded to provide ball shear, die shear, bump pull, vectored pull, or tweezer pull test. dage

 

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Dicing
dicing Manual, Full-Automatic & Dual Spindle Dicing Systems, Laser Scribing Systems, Peripheral equipment, Blades & Proces Development. adt

 

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Die Bonding
diebonding Tabletop Die Bond systems for development purposes. Full & Semi- Automatic, high accuracy Die Bond System for medium and high volume production. As wel as standard and customized tooling.
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Plasma Cleaning
plasma_cleaning From Tabletop systems to high volume in-line plasma threatment systems for advanced semiconductor packaging and assembly processes. web_logo_sm

 

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Soldering & Sealing
safety_test Vacuum furnaces for flux-free and void-free soldering, brazing and glass sealing solutions. Production of high precision graphite tooling and fixturing. logo

 

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Wire Bonding
wire_bonding Manual, Semi-Automatic and Full Automatic Wire Bond System for Wedge, Ball, Bump and Ribbon Bonding. High quality Capilary's, Wedges and Bonding Wires. hesse_knips_logo
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Consumables
sinewave A full range of consumbles to for your Dicing, Die Bond, Wire Bond and Test processes. adt
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01-March-2010
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20-nov-2009
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13-nov-2009
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10-nov-2009
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12-okt-2009
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Introduces new 61000-4-6 Conducted Immunity testsystem
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1-okt-2009
Data I/O
Introduces Flashcore III technology
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30-sept-2009
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10th edition Boundary Scan Day
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