MicroAssembly Technologies, Ltd.

MAT specializes in providing turn-key solutions for most advanced die attach applications. MAT's machines perform MCM and Flip Chip process for most complex assemblies. Should your application be Eutectic or Adhesive based die attach, our machines will handle it with high accuracy and yield.

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Model 6400
Model 6400 performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies. Pick up from wafflepack, trayfeeder wafer. Integrated volumetric dispenser, Flipchip.

Model 6900/6920
New generation Fully AutomaticMCM and Flip Chip Die Attach System. Developed for high volume production of Multi Chip Modules including active chip & wire and flip chip components, Magazine to Magazine or In-Line configuration. Based on the unique Two Head architecture that ensures highest Flexibility and Throughput in parallel with smallest Footprint. Handles up to Seventy Waffle/Gel packs, up to Forty Reel Feeders or up to TEN different 8" Wafers at a time.

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Model 6495/6496/6497
3 table top design die bonders, configurable to bond applications like Flip Chip, MCM/Hybrid/COB,
Silver Glass, Eutectic, Ultrasonic processes.

Request documentation

 

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