CyberTECHNOLOGIES Non-Contact Surface Measurement

CyberTECHNOLOGIES is the leading supplier of high‑resolution, non‑contact 3D measurement systems for industrial and scientific applications. The heart of the system is a range of high resolution optical sensors; confocal white light or laser‑based in point, line or microscope format.

Used worldwide, the advanced software solutions provide the user with a full range of options, from research to full automation. Microelectronics and surface engineering applications include thickfilm measurement, solar cell measurement, flatness, coplanarity, roughness, stress, TTV measurement and much more. The technology can work with solid, powder or liquid surfaces; opaque, translucent, transparent, as well as black or highly reflective surfaces.

CyberTECHNOLOGIES Applications


Vantage - Non‑contact surface measurement platform CyberTECHNOLOGIES Vantage Series

The cyberTECHNOLOGIES Vantage products are non‑contact surface measurement systems suited to production and cleanroom environments. The Vantage 50 provides a 2D profile capability using triangulation sensors for thick film work, and laser for solar panel assessment. The Vantage 2 offers a motorised 3D x and y axis covering a 200 mm square, with a manual height adjustment to 50 mm. It is ideal for a cleanroom environment. Both systems utilise the full ScanCT software for setting up, scanning, data acquisition, analysis and reporting.

CT - 2D and 3D non‑contact surface measurement platform CyberTECHNOLOGIES CT Series
The cyberTECHNOLOGIES CT products are designed with flexibility in mind. With a variety of granite platforms to 1.8 m square, sensor options include white light confocal, laser, confocal microscope and interferometry options for different materials. Working heights and measurement ranges can be selected for any application. Several platform types will support multiple sensors. Scanning round objects, or simultaneously scanning both sides of a sample are options. The rapid scanning process and full library of measurement parameters give a high degree of flexibility and automation to a wide range of surface engineering and microelectronic applications where size of sample, or the number to be scanned are important. Full automation of the process is available for production environments.

Inline CyberTECHNOLOGIES Inline
The cyberTECHNOLOGIES scanning platform is also available as an integrated solution to provide automated non‑contact scanning of any surface directly in the production process.

Optical sensor options for non‑contact surface measurement Optical sensor options for non‑contact surface measurement
The flexibility of the cyberTECHNOLOGIES systems relates to the range of optical sensors which the platforms and software can accommodate. A suitable sensor selection gives the user control over the measurement range and resolution required for the material and application; the working heights offer solutions where proximity of the sensor to the inspected surface is controlled by topography, type of light source improves results from difficult surfaces, and interferometry will measure flatness in ultra‑smooth surfaces.

Software for Surface Engineering and Metrology Software for Surface Engineering and Metrology
At the heart of the cyberTECHNOLOGIES product range is the comprehensive suite of functions provided to the operator by the Scan Suite software solution. Easy to work with, the software provides a complete solution for laboratory or production needs, and covers setting up, scanning, data acquisition, analysis and reporting. For repeat measurements and production needs, AScan will automate the processes involved, including full image analysis, and statistical process control reporting. The 3D graphics provide high resolution images of the captured data for report or presentation work.


Latest News


EM Test New ESD Simulator

NX 30 - New 30kV ESD Simulator with Bleed-off function.

EM Test Surge Generator for Solar Panel testing
New vSurge NX 20

3-phase Power Sources from EM Test
Netwave Series

MPE - World First Gb Ethernet Filter
Low-Pass EMI Filter

Rental solutions for EMC instrumentation
Accelonix Rental Service

Accelonix at E&A 2017
Accelonix exhibiting at Electronics & Applications 2017.
May 30 May to June 1th, Jaarbeurs Utrecht.

TestWay Seminar

DFx Software Tools to Optimize PCBA Manufacturing & Test Strategy.
April 4, Eindhoven

Yxlon FeinFocus

Non-Destructive X-ray Inspection Technology for Electronics.

Aster twSystem

New system level PCB viewer.

Hesse New BJ 955/959

New Bonder platform for Manual and Automated Heavy Wire Bonding.


Thermal Warpage & Strain Metrology Measurement Systems.

Non-Contact 3D Surface Metrology Measurement Systems.

TPT Wire Bonding Workshop
Learn about Wire Bonding and discover the TPT Solutions during this Free Workshop!


XRH Count
Revolution in automatic, contactless SMT component counting!

FEE EMC Seminar
Thank you for visiting us in St-Katelijne-Waver

Teseq ITS 6006B
Radiated immunity test system up to 6GHz, Second Generation released

Teseq NSG 4070B
RF immunity test system up to 1GHz. Now also supports draft version (2015) of ISO 7637-4

Teseq NSG 4060
Meets new immunity testing requirements range 15kHz-150kHz

MPE Plug-in Tempest Filters
Protect your IT systems with this range of convenient, plug-in TEMPEST filters

Accelonix BV has moved!
Accelonix has moved to a new office space since March 12th 2016

Data I/O LumenX
Data I/O Ultra-Fast eMMC Programming!

Accelonix News Archive